2024 8th International Conference on Mechanics, Mathematics and Applied Physics (ICMMAP 2024)

ICMMAP 2024

Previous ICMMAP conferences have been held successfully. The history of the conference is as follows:

The 1st conference (ICMMAP 2017) was held on November 24-26, 2017 in Hohhot, Inner Mongolia, China.

The 2nd conference (ICMMAP 2018) was held on July 28-30, 2018 in Zhuhai, Guangdong, China. 

The 3rd conference (ICMMAP 2019) was held on July 26-28, 2019 in Guilin, Guangxi, China.

The 4th conference (ICMMAP 2020) was held on July 17-19, 2020 in Lanzhou, Gansu, China (both online and offline).

The 5th conference (ICMMAP 2021) was held on July 23-25, 2021 in Nanjing, Jiangsu, China (both online and offline).

The 6th conference (ICMMAP 2022) was held on August 19-21, 2022 in Qingdao, Shandong, China (both online and offline).

The 7th conference (ICMMAP 2023) was held on September 8-10, 2023 in Dalian, Liaoning, China.

To exchange the latest progress in theory, technology and application in the field of mechanics, mathematics and applied physics in foreign countries in recent years and to show the latest achievements, the 2024 8th International Conference on Mechanics, Mathematics and Applied Physics (ICMMAP 2024) will hold an on-site conference on November 22-24, 2024 in Dalian, Liaoning, China.

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Important Dates

Full Paper Submission Date

June 30, 2024

Registration Deadline

November 15, 2024

Final Paper Submission Date

November 18, 2024

Conference Dates

November 22-24, 2024

To exchange the latest progress in theory, technology and application in the field of mechanics, mathematics and applied physics in foreign countries in recent years and to show the latest achievements, 2024 8th International Conference on Mechanics, Mathematics and Applied Physics (ICMMAP 2024) will be held in Dalian, Liaoning, China on November 22-24, 2024.

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Call For Papers

Topics of interest include but are not limited to

Mechanics

· Applied mechanics

· Computational mechanics

· Fluid mechanics

· Structural mechanics

· Solid mechanics

· Vibration theory

· Related topics

· Aerodynamics

· Multiphase fluid mechanics

· Rheology

· Electrohydrodynamics

· Magnetohydrodynamics

· Aerodynamics

Mathematics

· Combinatorial mathematics

· Finite group

· Geometry and global differential geometry

· Elementary algebraic topology

· Differential dynamical system

· Mathematical model

· Topology

· Differential geometry

· Partial differential equation

· Laplace transform

· Related topics

· Simulation and Monte-Carlo methods

· Mathematical analysis

· Function theory

· Discrete mathematics

· Lie group and representation

· Linear algebra

· Matrix theory

· Vector analysis

· Differential equation

· Fourier analysis

Physics

· Physics and applied Physics

· Nuclear physics

· Mechanics and theoretical mechanics

· Electromagnetism

· Atomic physics

· Electrodynamics

· Quantum mechanics

· Structure and physical properties

· Nuclear electronics

· Nuclear technology and application

· Quantum electronic informatics

· Optical quantum informatics

· Semiconductor physics

· Optoelectronics

· Solid state physics

· Related topics

Details of the Registration

1. Registration fees include conference proceedings, lunches, souvenirs and attending all technical sessions.

2. The registration fee does not include: 

   • Accommodation

   • Visa application fee

   • Transportation fare

3. At least one author for each accepted final paper must pre-register.

4. Completed registrations will be acknowledged by the Organizing Committee within 2-5 workdays after receiving your payment.

5. If you cannot attend the conference due to some reasons, we will post the print proceedings to you together with the payment receipt/Fapiao.

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Program

November 22, 2024

Registration

November 23, 2024

Keynote Speeches + Oral Presentations

November 24, 2024

Academic Investigation

Hosted By

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Contact

Conference Secretary: Mr. Li

Tel: +86-13922150148 (WeChat)

E-Mail: ic_mmap@163.com

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* If you have any questions or comments, please feel free to contact us.